If you’re [Karta] or [Luumi], you 3D print a new retaining ... and some sort of thermal media or paste to fill in any gaps between the CPU case and the heat sink. Intel’s LGA1700 bracket ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback