Some of what Apple’s rolled out (so far…it’s only Wednesday night as I write these words) this week was accurately ...

Arm’s edge AI platform features the Cortex-A320 CPU and Ethos-U85 NPU, enabling on-device execution of models exceeding 1 ...

Infineon’s PSOC 4 series microcontrollers now integrate capacitive, inductive, and liquid level sensing in a single device.

Marvell Technology has demonstrated its first 2-nm silicon IP, enhancing the performance and efficiency of AI and cloud ...

Rohm Semiconductor introduced the GNP2070TD-Z, a 650-V enhancement-mode GaN HEMT in a TO-leadless (TOLL) package. With dimensions of 11.68×9.9×2.4 mm, this compact package enhances heat dissipation, ...

A cloud platform that streamlines the design process from component selection to software development to OTA updates.

A new type of smart interconnect IP can leverage ML heuristics to dramatically speed up the creation of high-performance SoCs ...

A simple three-component solution for a switching regulator chip to use for output voltage programming via PWM.

(“Arcing”—which can ignite nearby flammable substances—occurs when electrical energy jumps across a gap between conductors; ...

Malaysia’s Prime Minister told reporters that the deal to bring Arm in the country will be finalized this month.

Limited-use, mystery ICs. Overheating tendencies. And close ties to an abruptly terminated service. So goes the world of ...

In an MCU, capacitive sensing combined with inductive and liquid sensing significantly broadens application range.